MSE Master of Science in Engineering

The Swiss engineering master's degree


Each module contains 3 ECTS. You choose a total of 10 modules/30 ECTS in the following module categories: 

  • 12-15 ECTS in technical scientific modules (TSM)
    TSM modules teach profile-specific specialist skills and supplement the decentralised specialisation modules.
  • 9-12 ECTS in fundamental theoretical principles modules (FTP)
    FTP modules deal with theoretical fundamentals such as higher mathematics, physics, information theory, chemistry, etc. They will teach more detailed, abstract scientific knowledge and help you to bridge the gap between abstraction and application that is so important for innovation.
  • 6-9 ECTS in context modules (CM)
    CM modules will impart additional skills in areas such as technology management, business administration, communication, project management, patent law, contract law, etc.

In the module description (download pdf) you find the entire language information per module divided into the following categories:

  • instruction
  • documentation
  • examination 
Advanced Electronic Design (TSM_AdvElDes)

This Advanced Electronic Design module gives to the students the key elements for the development of high performance electronic systems. These systems are characterized by:

  • a mixed-signal PCB (Printed Circuit Board)
  • the presence of sensitive analogue circuits and signals
  • the presence of complex and high-speed digital ICs (Integrated Circuits)

Prerequisites

The student must have knowledge and experience in the following areas:

  • Circuit analysis
  • Electrical and magnetic fields
  • Active and passive electronic components, operational amplifiers
  • AD and DA conversion principle
  • Digital circuits

Learning Objectives

  • The student masters the technologies used in the development of high-performance printed circuit boards.
  • The student is able to design a high-performance electronic board composed of sensitive analogue, mixed signal and high speed digital circuits.
  • The student is able to implement high-speed and high-resolution signal processing chains based on A/D and D/A converters, analogue functions blocs and complex digital ICs

Contents of Module

The topics of this module can be grouped into three different subject areas. Therefore three courses are proposed. Each course is taught by a different person.

 

 

Course

 
 

Title

 
 

Weeks

 
 

Emphasis

 
 

1

 
 

High-performance PCB development :

  • PCB technologies: materials, multi-layers, micro vias
  • PCB design: EMC, signal integrity, grounding and power supply routing, decoupling, transmission lines and effects, simulation tools
  • Board assembly: IC package, chip-on-board, soldering, heat transfer, testability
 

1 – 4

 
 

~30%

 
 

2

 
 

High-speed digital electronic design :

  • high-speed signaling and timing, clock distribution, skew, jitter, latch-based design, low-power
 

5 – 8

 
 

~30%

 
 

3

 
 

Advanced analogue electronic design :

  • Advanced operational amplifier applications: low level and sensor signal conditioning, electronic noise, high-speed and low-power amplifiers, frequency response analysis
  • Advanced ADC and DAC implementations: high-speed, high-resolution, sigma-delta converter, low-power, anti-aliasing and post-filter
 

9 – 14

 
 

~40%

 

Teaching and Learning Methods

  • Lecture
  • Exercises
  • Presentation and discussion of case studies
  • Self-study of the presented cases and exercises

Literature

Electromagnetic Compatibility Engineering, Henry W. Ott, Wiley, 2009.

The Op Amp Applications Handbook, Walt Jung, Analog Devices, 2006.

The Data Conversion Handbook, Walt Kester, Analog devices, March 2004.

High Speed Signal Propagation: Advanced Black Magic, Howard Johnson – Martin Graham, Prentice Hall, 2003.

Op Amps for everyone, Ron Mancini, Texas Instruments, 2002.

Download full module description

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